Welcome to ichome.com!
Name | Value |
---|---|
Product Status | Obsolete |
Type | PGA, ZIF (ZIP) |
Number of Positions or Pins (Grid) | 370 (19 x 19) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
Contact Material - Mating | Copper Alloy |
Mounting Type | Through Hole |
Features | Open Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | 30.0µin (0.76µm) |
Contact Material - Post | Copper Alloy |
Housing Material | Liquid Crystal Polymer (LCP) |
Operating Temperature | - |
Dedicated to exceeding your expectations. IChome: Customer service redefined for the electronics industry.