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24-516-10

24-516-10

24-516-10

Aries Electronics

CONN IC DIP SOCKET ZIF 24POS TIN

non-compliant

24-516-10 Pricing & Ordering

Quantity Unit Price Ext. Price
1 $0.00000 $0
500 $0 $0
1000 $0 $0
1500 $0 $0
2000 $0 $0
2500 $0 $0
0 items
Bom Cost Down
Bom Cost Down
Wholesale Prices for Every Order, Big or Small
Wholesale Prices for Every Order, Big or Small
Name Value
Product Status Obsolete
Type DIP, ZIF (ZIP)
Number of Positions or Pins (Grid) 24 (2 x 12)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Tin
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 10.0µin (0.25µm)
Contact Material - Post Beryllium Copper
Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature -
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