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Name | Value |
---|---|
Product Status | Active |
Type | SIP |
Number of Positions or Pins (Grid) | 24 (1 x 24) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | Flash |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | - |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Tin |
Contact Finish Thickness - Post | 196.9µin (5.00µm) |
Contact Material - Post | Brass |
Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
Operating Temperature | -55°C ~ 125°C |
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