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824-AG32D

824-AG32D

824-AG32D

CONN IC DIP SOCKET 24POS TINLEAD

compliant

824-AG32D Pricing & Ordering

Quantity Unit Price Ext. Price
1 $0.00000 $0
500 $0 $0
1000 $0 $0
1500 $0 $0
2000 $0 $0
2500 $0 $0
0 items
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Wholesale Prices for Every Order, Big or Small
Wholesale Prices for Every Order, Big or Small
Name Value
Product Status Obsolete
Type DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 24 (2 x 12)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Tin-Lead
Contact Finish Thickness - Mating 80.0µin (2.03µm)
Contact Material - Mating Copper Alloy
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin-Lead
Contact Finish Thickness - Post -
Contact Material - Post Copper Alloy
Housing Material Polyester
Operating Temperature -55°C ~ 105°C
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