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808-AG11D-ES-LF

808-AG11D-ES-LF

808-AG11D-ES-LF

CONN IC DIP SOCKET 8POS GOLD

non-compliant

808-AG11D-ES-LF Pricing & Ordering

Quantity Unit Price Ext. Price
1 $1.41000 $1.41
10 $1.23600 $12.36
25 $1.16360 $29.09
60 $1.11517 $66.9102
120 $1.06667 $128.0004
300 $0.96967 $290.901
540 $0.87269 $471.2526
1,020 $0.77573 -
2,520 $0.70300 -
0 items
Bom Cost Down
Bom Cost Down
Wholesale Prices for Every Order, Big or Small
Wholesale Prices for Every Order, Big or Small
Name Value
Product Status Obsolete
Type DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 8 (2 x 4)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 20.0µin (0.51µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Gold
Contact Finish Thickness - Post 20.0µin (0.51µm)
Contact Material - Post Copper
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature -55°C ~ 105°C
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