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BU400Z-178-HT

BU400Z-178-HT

BU400Z-178-HT

CONN IC DIP SOCKET 40POS GOLD

compliant

BU400Z-178-HT Pricing & Ordering

Quantity Unit Price Ext. Price
1 $6.98000 $6.98
10 $6.69300 $66.93
30 $6.11100 $183.33
50 $5.82000 $291
100 $5.52900 $552.9
250 $4.94700 $1236.75
500 $4.65600 $2328
1,000 $4.07400 -
2,500 $3.87030 -
0 items
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Wholesale Prices for Every Order, Big or Small
Wholesale Prices for Every Order, Big or Small
Name Value
Product Status Obsolete
Type DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 40 (2 x 20)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 78.7µin (2.00µm)
Contact Material - Mating Beryllium Copper
Mounting Type Surface Mount
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Copper
Contact Finish Thickness - Post Flash
Contact Material - Post Brass
Housing Material Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature -55°C ~ 125°C
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