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| Name | Value |
|---|---|
| Product Status | Active |
| Type | Solder Paste |
| Composition | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) |
| Diameter | - |
| Melting Point | 423 ~ 430°F (217 ~ 221°C) |
| Flux Type | No-Clean |
| Wire Gauge | - |
| Mesh Type | - |
| Process | Lead Free |
| Form | Syringe, 0.88 oz (25g) |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 35°F ~ 50°F (2°C ~ 10°C) |
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