Welcome to ichome.com!
| Name | Value |
|---|---|
| Product Status | Active |
| Type | Solder Paste |
| Composition | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) |
| Diameter | - |
| Melting Point | 423 ~ 430°F (217 ~ 221°C) |
| Flux Type | No-Clean |
| Wire Gauge | - |
| Mesh Type | - |
| Process | Lead Free |
| Form | Jar, 8.8 oz (250g) |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 35°F ~ 50°F (2°C ~ 10°C) |
Dedicated to exceeding your expectations. IChome: Customer service redefined for the electronics industry.