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| Name | Value |
|---|---|
| Product Status | Active |
| Type | Wire Solder |
| Composition | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) |
| Diameter | 0.032" (0.81mm) |
| Melting Point | 423 ~ 430°F (217 ~ 221°C) |
| Flux Type | No-Clean |
| Wire Gauge | 20 AWG, 21 SWG |
| Mesh Type | - |
| Process | Lead Free |
| Form | Spool, 1 lb (454 g) |
| Shelf Life | 60 Months |
| Shelf Life Start | - |
| Storage/Refrigeration Temperature | 65°F ~ 80°F (18°C ~ 27°C) |
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