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| Name | Value |
|---|---|
| Product Status | Obsolete |
| Type | Solder Paste |
| Composition | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 |
| Diameter | - |
| Melting Point | 408 ~ 424°F (209 ~ 218°C) |
| Flux Type | No-Clean |
| Wire Gauge | - |
| Mesh Type | - |
| Process | Lead Free |
| Form | Jar, 17.64 oz (500g) |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | - |
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