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Name | Value |
---|---|
Product Status | Not For New Designs |
Type | Solder Paste |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Melting Point | 423°F (217°C) |
Flux Type | Water Soluble |
Wire Gauge | - |
Mesh Type | - |
Process | Lead Free |
Form | Cartridge, 17.64 oz (500g) |
Shelf Life | 6 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 35.6°F ~ 46.4°F (2°C ~ 8°C) |
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