Welcome to ichome.com!

logo
Home

HSB27-434316

HSB27-434316

HSB27-434316

CUI Devices

HEAT SINK, BGA, 43.1 X 43.1 X 16

compliant

HSB27-434316 Pricing & Ordering

Quantity Unit Price Ext. Price
1 $2.60000 $2.6
500 $2.574 $1287
1000 $2.548 $2548
1500 $2.522 $3783
2000 $2.496 $4992
2500 $2.47 $6175
1103 items
Bom Cost Down
Bom Cost Down
Wholesale Prices for Every Order, Big or Small
Wholesale Prices for Every Order, Big or Small
Name Value
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Adhesive
Shape Square, Pin Fins
Length 1.697" (43.10mm)
Width 1.697" (43.10mm)
Diameter -
Fin Height 0.650" (16.51mm)
Power Dissipation @ Temperature Rise 8.98W @ 75°C
Thermal Resistance @ Forced Air Flow 2.80°C/W @ 200 LFM
Thermal Resistance @ Natural 8.35°C/W
Material Aluminum Alloy
Material Finish Black Anodized
PDF loading failed, you can try to open in a new window to access [Open], or click to return

Related Part Number

Your Reliable Partner In Electronics

Dedicated to exceeding your expectations. IChome: Customer service redefined for the electronics industry.