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HSB23-232325

HSB23-232325

HSB23-232325

CUI Devices

HEAT SINK, BGA, 23 X 23 X 25 MM

compliant

HSB23-232325 Pricing & Ordering

Quantity Unit Price Ext. Price
1 $1.37000 $1.37
500 $1.3563 $678.15
1000 $1.3426 $1342.6
1500 $1.3289 $1993.35
2000 $1.3152 $2630.4
2500 $1.3015 $3253.75
1241 items
Bom Cost Down
Bom Cost Down
Wholesale Prices for Every Order, Big or Small
Wholesale Prices for Every Order, Big or Small
Name Value
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Adhesive
Shape Square, Pin Fins
Length 0.906" (23.00mm)
Width 0.906" (23.00mm)
Diameter -
Fin Height 0.984" (25.00mm)
Power Dissipation @ Temperature Rise 6.13W @ 75°C
Thermal Resistance @ Forced Air Flow 3.80°C/W @ 200 LFM
Thermal Resistance @ Natural 12.23°C/W
Material Aluminum Alloy
Material Finish Black Anodized
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