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HSB15-404010

HSB15-404010

HSB15-404010

CUI Devices

HEAT SINK, BGA, 40 X 40 X 10 MM

non-compliant

HSB15-404010 Pricing & Ordering

Quantity Unit Price Ext. Price
1 $1.10858 $1.10858
500 $1.0974942 $548.7471
1000 $1.0864084 $1086.4084
1500 $1.0753226 $1612.9839
2000 $1.0642368 $2128.4736
2500 $1.053151 $2632.8775
0 items
Bom Cost Down
Bom Cost Down
Wholesale Prices for Every Order, Big or Small
Wholesale Prices for Every Order, Big or Small
Name Value
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Adhesive
Shape Square, Pin Fins
Length 1.575" (40.00mm)
Width 1.575" (40.00mm)
Diameter -
Fin Height 0.394" (10.00mm)
Power Dissipation @ Temperature Rise 6.3W @ 75°C
Thermal Resistance @ Forced Air Flow 3.90°C/W @ 200 LFM
Thermal Resistance @ Natural 11.84°C/W
Material Aluminum Alloy
Material Finish Black Anodized
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