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HSB07-202009

HSB07-202009

HSB07-202009

CUI Devices

HEAT SINK, BGA, 20 X 20 X 9 MM

compliant

HSB07-202009 Pricing & Ordering

Quantity Unit Price Ext. Price
1 $0.58140 $0.5814
500 $0.575586 $287.793
1000 $0.569772 $569.772
1500 $0.563958 $845.937
2000 $0.558144 $1116.288
2500 $0.55233 $1380.825
Inventory changes frequently.
Bom Cost Down
Bom Cost Down
Wholesale Prices for Every Order, Big or Small
Wholesale Prices for Every Order, Big or Small
Name Value
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Adhesive
Shape Square, Pin Fins
Length 0.787" (20.00mm)
Width 0.787" (20.00mm)
Diameter -
Fin Height 0.354" (9.00mm)
Power Dissipation @ Temperature Rise 3.1W @ 75°C
Thermal Resistance @ Forced Air Flow 8.60°C/W @ 200 LFM
Thermal Resistance @ Natural 24.08°C/W
Material Aluminum Alloy
Material Finish Black Anodized
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