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BDN15-3CB/A01

BDN15-3CB/A01

BDN15-3CB/A01

HEATSINK CPU W/ADHESIVE 1.51"SQ

non-compliant

BDN15-3CB/A01 Pricing & Ordering

Quantity Unit Price Ext. Price
1,000 $2.10319 -
0 items
Bom Cost Down
Bom Cost Down
Wholesale Prices for Every Order, Big or Small
Wholesale Prices for Every Order, Big or Small
Name Value
Product Status Active
Type Top Mount
Package Cooled Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method Thermal Tape, Adhesive (Included)
Shape Square, Pin Fins
Length 1.510" (38.35mm)
Width 1.510" (38.35mm)
Diameter -
Fin Height 0.355" (9.02mm)
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow 4.50°C/W @ 400 LFM
Thermal Resistance @ Natural 15.10°C/W
Material Aluminum
Material Finish Black Anodized
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