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| Name | Value |
|---|---|
| Product Status | Active |
| Type | Solder Paste |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | - |
| Melting Point | 423°F (217°C) |
| Flux Type | No-Clean |
| Wire Gauge | - |
| Mesh Type | 4 |
| Process | - |
| Form | Syringe, 1.23 oz (34.869g) |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
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