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| Name | Value |
|---|---|
| Product Status | Active |
| Type | Solder Sphere |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | 0.030" (0.76mm) |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) |
| Flux Type | - |
| Wire Gauge | - |
| Mesh Type | - |
| Process | Lead Free |
| Form | Jar |
| Shelf Life | 24 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | - |
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