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PA0196

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  • PA0196

PA0196

PA0196

Chip Quik Inc.

TSSOP-64-EXP-PAD TO DIP-64 SMT

PA0196 Datasheet

non-compliant

PA0196 Pricing & Ordering

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Name Value
Product Status Active
Proto Board Type SMD to DIP
Package Accepted TSSOP
Number of Positions 64
Pitch 0.020" (0.50mm)
Board Thickness 0.062" (1.57mm) 1/16"
Material FR4 Epoxy Glass
Size / Dimension 1.000" x 3.200" (25.40mm x 81.28mm)
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