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| Name | Value |
|---|---|
| Product Status | Active |
| Type | Solder Paste |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | - |
| Melting Point | 423 ~ 424°F (217 ~ 218°C) |
| Flux Type | Rosin Mildly Activated (RMA) |
| Wire Gauge | - |
| Mesh Type | - |
| Process | Lead Free |
| Form | Spool, 1 lb (454 g) |
| Shelf Life | - |
| Shelf Life Start | - |
| Storage/Refrigeration Temperature | - |
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