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| Name | Value |
|---|---|
| Product Status | Active |
| Type | SOIC |
| Number of Positions or Pins (Grid) | 16 (2 x 8) |
| Pitch - Mating | 0.050" (1.27mm) |
| Contact Finish - Mating | Tin |
| Contact Finish Thickness - Mating | 100.0µin (2.54µm) |
| Contact Material - Mating | Copper Alloy |
| Mounting Type | Surface Mount |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.050" (1.27mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 100.0µin (2.54µm) |
| Contact Material - Post | Copper Alloy |
| Housing Material | Thermoplastic |
| Operating Temperature | - |
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