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Name | Value |
---|---|
Product Status | Active |
Type | Board Level |
Package Cooled | BGA, FPGA |
Attachment Method | Solder Anchor |
Shape | Square, Pin Fins |
Length | 1.063" (27.00mm) |
Width | 1.063" (27.00mm) |
Diameter | - |
Fin Height | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise | 1.5W @ 50°C |
Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 500 LFM |
Thermal Resistance @ Natural | 30.60°C/W |
Material | Aluminum |
Material Finish | Black Anodized |
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