Welcome to ichome.com!

logo
Home

374324B60023G

374324B60023G

374324B60023G

BGA HEAT SINK

compliant

374324B60023G Pricing & Ordering

Quantity Unit Price Ext. Price
1 $6.34000 $6.34
10 $6.17500 $61.75
25 $5.85040 $146.26
50 $5.52500 $276.25
100 $5.20000 $520
250 $4.87500 $1218.75
500 $4.55000 $2275
1,000 $4.46875 -
4757 items
Bom Cost Down
Bom Cost Down
Wholesale Prices for Every Order, Big or Small
Wholesale Prices for Every Order, Big or Small
Name Value
Product Status Active
Type Board Level
Package Cooled BGA, FPGA
Attachment Method Solder Anchor
Shape Square, Pin Fins
Length 1.063" (27.00mm)
Width 1.063" (27.00mm)
Diameter -
Fin Height 0.394" (10.00mm)
Power Dissipation @ Temperature Rise 1.5W @ 50°C
Thermal Resistance @ Forced Air Flow 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural 30.60°C/W
Material Aluminum
Material Finish Black Anodized
PDF loading failed, you can try to open in a new window to access [Open], or click to return

Related Part Number

Your Reliable Partner In Electronics

Dedicated to exceeding your expectations. IChome: Customer service redefined for the electronics industry.