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| Name | Value |
|---|---|
| Product Status | Active |
| Type | Board Level |
| Package Cooled | BGA, FPGA |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Shape | Square, Pin Fins |
| Length | 1.063" (27.00mm) |
| Width | 1.063" (27.00mm) |
| Diameter | - |
| Fin Height | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise | 3.0W @ 90°C |
| Thermal Resistance @ Forced Air Flow | 9.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 30.60°C/W |
| Material | Aluminum |
| Material Finish | Black Anodized |
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