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| Name | Value |
|---|---|
| Product Status | Active |
| Type | QFN |
| Number of Positions or Pins (Grid) | 24 (4x4) |
| Pitch - Mating | 0.020" (0.50mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | - |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | - |
| Termination | Solder |
| Pitch - Post | - |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | - |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polyethersulfone (PES) |
| Operating Temperature | - |
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