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| Name | Value |
|---|---|
| Product Status | Active |
| Type | SIP, ZIF (ZIP) |
| Number of Positions or Pins (Grid) | 20 (1 x 20) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | - |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | - |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 30.0µin (0.76µm) |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polysulfone (PSU), Glass Filled |
| Operating Temperature | -55°C ~ 125°C |
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