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Name | Value |
---|---|
Product Status | Obsolete |
Type | PGA, ZIF (ZIP) |
Number of Positions or Pins (Grid) | 120 (13 x 13) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Gold |
Contact Finish Thickness - Mating | 30.0µin (0.76µm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Gold |
Contact Finish Thickness - Post | 30.0µin (0.76µm) |
Contact Material - Post | Beryllium Copper |
Housing Material | Polyethersulfone (PES) |
Operating Temperature | -55°C ~ 150°C |
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