Xilinx Inc. XCR3256XL-10TQG144C
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Xilinx Inc. XCR3256XL-10TQG144C information
Type
Parameter
Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
144-LQFP
Number of Pins
144
Operating Temperature
0°C~70°C TA
Packaging
Tray
Published
2003
Series
CoolRunner XPLA3
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
144
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Additional Feature
YES
HTS Code
8542.39.00.01
Subcategory
Programmable Logic Devices
Technology
CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.5mm
Reflow Temperature-Max (s)
30
Pin Count
144
Qualification Status
Not Qualified
Operating Supply Voltage
3.3V
Programmable Type
In System Programmable (min 1K program/erase cycles)
Max Supply Voltage
3.6V
Min Supply Voltage
3V
Number of I/O
120
Memory Type
EEPROM
Propagation Delay
10 ns
Number of Logic Elements/Cells
16
Number of Gates
6000
Max Frequency
105MHz
Speed Grade
10
Output Function
MACROCELL
Number of Macro Cells
256
JTAG BST
YES
Voltage Supply - Internal
3V~3.6V
Delay Time tpd(1) Max
9.1ns
Height
1.4mm
Length
20mm
Width
20mm
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Assembly/Origin :
XCR3256XL-10TQG144C Overview
Currently, there are 256 macro cells, which are low-power cell sites (towers, antennas, masts) that serve as radio coverage.You can find it in package [0].In this case, there are 120 I/Os programmed.It is programmed that device terminations will be 144 .The terminal position of this electrical component is QUAD.The power source is powered by 3.3Vvolts.This part is part of the family [0].Trayis the packaging method.It operates with the operating temperature of 0°C~70°C TA to ensure its reliability.The chip should be mounted by Surface Mount.The CoolRunner XPLA3series comprises this type of FPGA.Chips are programmed with 144 pins.If this device is used, you will also be able to find [0].It is possible to construct digital circuits using 6000gates, which are devices that serve as building blocks.It is recommended that the supply voltage be kept at 3.3Vto maximize efficiency.In order to store data, EEPROMis used.The electronic component is mounted by Surface Mount.It is designed with 144 pins.It operates with the maximal supply voltage of 3.6V.In order for it to operate, a supply voltage of 3Vis required.It is recommended that the maximum frequency be less than 105MHz.There are 16 logic elements/cells on the device.
XCR3256XL-10TQG144C Features
144-LQFP package
120 I/Os
The operating temperature of 0°C~70°C TA
144 pin count
144 pins
XCR3256XL-10TQG144C Applications
There are a lot of Xilinx Inc. XCR3256XL-10TQG144C CPLDs applications.
- LED Lighting systems
- ANALOG-TO-DIGITAL CONVERTOR (ADC)
- Random logic replacement
- Software Configuration of Add-In Boards
- STANDARD SERIAL INTERFACE UART
- Preset swapping
- Software-Driven Hardware Configuration
- Multiple Clock Source Selection
- Programmable polarity
- D/T registers and latches
- ImagePart NumberManufacturerPackage / CaseNumber of PinsPropagation DelayNumber of Macro CellsNumber of I/OMemory TypeMax FrequencyMin Supply VoltageSupply VoltageView Compare
XCR3256XL-10TQG144C
Xilinx Inc.144-LQFP
144
10 ns
256
120
EEPROM
105 MHz
3 V
3.3 V
- XC95288XL-10TQ144IXilinx Inc.
144-LQFP
144
10 ns
288
117
FLASH
-
3 V
3.3 V
XCR3256XL-10TQG144C
VS
XC95288XL-10TQ144I
- XC95288XL-10TQG144IXilinx Inc.
144-LQFP
144
10 ns
288
117
FLASH
-
3 V
3.3 V
XCR3256XL-10TQG144C
VS
XC95288XL-10TQG144I
- XC95288XL-7TQ144IXilinx Inc.
144-LQFP
144
7.5 ns
288
117
FLASH
125 MHz
3 V
3.3 V
XCR3256XL-10TQG144C
VS
XC95288XL-7TQ144I
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Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
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