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| Name | Value |
|---|---|
| Product Status | Active |
| Type | Solder Paste |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | - |
| Melting Point | 350°F (177°C) |
| Flux Type | No-Clean |
| Wire Gauge | - |
| Mesh Type | - |
| Process | Lead Free |
| Form | Jar, 17.64 oz (500g) |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | - |
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