Microchip Technology ATF22LV10C-10XU
ATF22LV10C-10XU
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Microchip Technology ATF22LV10C-10XU information
Type
Parameter
Factory Lead Time
6 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
24-TSSOP (0.173, 4.40mm Width)
Number of Pins
24
Packaging
Tube
Published
1997
Series
22V10
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
2 (1 Year)
Number of Terminations
24
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Subcategory
Programmable Logic Devices
Technology
CMOS
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.65mm
Frequency
83.3MHz
Reflow Temperature-Max (s)
40
Base Part Number
ATF22LV10C
Number of Outputs
10
Qualification Status
Not Qualified
Power Supplies
3.3/5V
Temperature Grade
OTHER
Programmable Type
EE PLD
Max Supply Voltage
5.5V
Min Supply Voltage
3V
Number of I/O
10
Voltage - Input
3.3V
Nominal Supply Current
90mA
Max Supply Current
90mA
Propagation Delay
10 ns
Turn On Delay Time
10 ns
Access Time
10 ns
Architecture
PAL-TYPE
Number of Gates
350
Output Function
MACROCELL
Number of Macro Cells
10
Number of Dedicated Inputs
10
Number of Product Terms
132
Height Seated (Max)
1.2mm
Length
7.8mm
Width
4.4mm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
microchiptechnology-atf22lv10c10xu-datasheets-2874.pdf
microchip-atf22lv10c10xu-datasheets-3347.pdf
- PCN Design/Specification :
microchiptechnology-ata8204p3ctkqw-pcndesignspecification-9786.pdf
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
ATF22LV10C-10XU Overview
A Type Surface Mount mount is used to mount the PLD stock.The programmable type of PLD Programmable logic device? is EE PLD.As a result of Programmable logic array's performance-cost ratio, 22V10 Series is one of the best values available today.Electronics manufacturers use the 24-TSSOP (0.173, 4.40mm Width) because of Programmable logic array's package.Materials from Tube are used to make the packaging.This voltage is supplied as the input to 3.3V.There are always 10 macro cells.ATF22LV10C is the PLD stock's largest Complex Programmable logic device.Surface Mount is mounted in the way of the PLD.Pin number 24 remains the same for the Complex Programmable logic device.When 83.3MHz frequency is used, it still functions precisely.As of now, 85°C is the maximum working temperature.In Programmable logic device's operation, it should be warmer than -40°C.A supply voltage of 3V volts is necessary for it to function.There is 5.5V supply voltage that can be used with Programmable logic controller.10 I/Os can be programmed.The Complex Programmable logic device is powered from a source of 3.3V at all times.The board is equipped with 10-dedicated inputs.It has been programmed with a 24 termination.There is also the possibility of applying the Programmable Logic Devices subcategory.Supplies 3.3/5V are used in the Programmable logic device.There are 132 product terms.A number of 10 outputs are available.A maximum supply temperature of 90mA is possible.Gates with 350 symbols exist.
ATF22LV10C-10XU Features
Mounting type of Surface Mount
Input voltage of 3.3V
Maximum temperature of 85°C
10 I/Os
ATF22LV10C-10XU Applications
There are a lot of Microchip Technology ATF22LV10C-10XU PLDs (Programmable Logic Device) applications.
- Low power applications
- Highly complex logic
- High-speed Devices
- Various types of power-limited applications
- Power-limited applications
- Programmable Logic Devices
- Industrial
- High-end communication equipment
- high-performance microcomputer systems
- Battery operated devices
- ImagePart NumberManufacturerPackage / CaseNumber of PinsFrequencyMin Supply VoltageSupply VoltageMax Supply VoltageTechnologyMountView Compare
ATF22LV10C-10XU
Microchip Technology24-TSSOP (0.173, 4.40mm Width)
24
83.3 MHz
3 V
3.3 V
5.5 V
CMOS
Surface Mount
ATF16LV8C-10XUMicrochip Technology20-TSSOP (0.173, 4.40mm Width)
20
83.3 MHz
3 V
3.3 V
5.5 V
CMOS
Surface Mount
ATF22LV10C-10XU
VS
ATF16LV8C-10XU
- ADF7012BRUZAnalog Devices Inc.
24-TSSOP (0.173, 4.40mm Width)
24
75MHz ~ 1GHz
-
3 V
-
CMOS
Surface Mount
ATF22LV10C-10XU
VS
ADF7012BRUZ
- ATF750LVC-15XUMicrochip Technology
24-TSSOP (0.173, 4.40mm Width)
24
71 MHz
3 V
3.3 V
3.6 V
CMOS
Surface Mount
ATF22LV10C-10XU
VS
ATF750LVC-15XU
- ATF750CL-15XUMicrochip Technology
24-TSSOP (0.173, 4.40mm Width)
24
44 MHz
4.5 V
5 V
5.5 V
CMOS
Surface Mount
ATF22LV10C-10XU
VS
ATF750CL-15XU
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You Also Ask
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
 |  |  |  |  |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
